De v i c e s , I n c .
it's Integrated Module family - iMOD
product family facilitates the
integration of LOGIC Devices' silicon IP as well as silicon IP
from other semiconductor
manufacturers, thereby providing high density packaged product
solutions from memory arrays,
sub-systems, up to and including highly integrated systems
LOGIC Devices, a developer of high performance, low power
integrated circuits; recently announced its latest product
family, a grouping of multi-chip integrated devices. This
LOGIC Devices first iMOD products in
development include our leadership product, a DDR3
wide-word device, a grouping of DDR1 wide-word modules, as
well as, a grouping of DDR2
- 4.0Gb, 16mm x 22mm, Wide-Word
Integrated Multi-Chip Module
An integrated DDR3, x64bit data-path memory
device supporting DDR3- 1333
at Industrial temperature, DDR3-1066 at Extended temperature
and DDR3-800 at Military temperature supporting CL10-10-10,
CL8-8-8 and CL6-6-6 respectively while packaged in a 16mm x
22mm, 271 ball-1.00mm pitch footprint.
Our 4.0Gb DDR3 packaged solution saves you
>40% board real-estate while reducing your parent board
routing requirements by 30% when compared with the monolithic
solution based on use of (4) 96ball, 9.0mm x 16.0mm FBGA's.
To meet the ECC requirements, a x72 bit
version of DDR2
and DDR3 will become available in the 4th quarter .
About LOGIC Devices, Inc.
LOGIC Devices is focused on developing high
performance digital silicon and integrated product solutions
for high performance, power sensitive applications. Our
products meet or exceed the requirements for broadcast video,
medical imaging, industrial-embedded computers, surveillance,
and instrumentation as well as telecommunications companies.
For addtional product information on
LOGICDevices products including our iMOD family, CONSULTING
please contact ZWINZ TECHNICAL
Product Sales support
For product availability and/or to request
a Price and Delivery quotation on
any LOGIC Devices product,
please email: firstname.lastname@example.org