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ZARLINK
ADVANCED PACKAGING
Expertise
in micro-packing—smaller, faster, more reliable
Zarlink’s
Advanced Packaging division delivers a competitive advantage
for its customers by miniaturising electronic
components to create smaller, smarter and
more reliable circuit solutions with a board footprint
significantly smaller than individual ICs.
Proven
Micro-Packaging Expertise
With a track
record of success in designing and developing Advanced Packaging
modules, Zarlink’s micro-packing expertise is at the heart of
mission-critical and cutting-edge medical, telecom, industrial,
aerospace and military applications.
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Key technology
in ultra-reliable applications, such as pacemakers,
defibrillators and hearing aids
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Designed and
assembled a module for the world’s smallest pacemaker
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Developed
patented in-body antenna technology for medical products
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Designed world’s
smallest network timing module for Stratum 3
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applications
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Developed
“circuit on steel” packaging technology that halves the
footprint of motor drive controllers and
enhances reliability
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Developed and
manufactured low-cost microwave splitter components
Packaging
Technologies
Zarlink Advanced
Packaging specialises in the custom design and manufacture of
electronic packaging and supports all major technologies,
including:
Improve
Performance, Reduce Cost
Our packaging
solutions enhance circuit and thermal performance capabilities
with increased product reliability. SIP technology delivers
significant reductions in both design cost and time-to-market
over competing custom silicon options.
Leader
in Micro-Packaging Design and Manufacturing
Zarlink Advanced
Packaging employs over 40 engineers supported by the latest
hardware and software design tools to provide one of the most
experienced Advanced Packaging design facilities in Europe. This
integrated research, design and manufacturing facility is
supported with onsite business services, sales and project
management capabilities for seamless customer service delivery.
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