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Zarlink
Joins Consortium Developing “Smart Flex” Packaging for the
Miniaturization ofCarry-Along Personal Electronic Systems
- European
Commission-funded SHIFT Project focusing on
highly integrated,
mechanically flexible electronic systems
CALDICOT,
UK, April 11, 2007 – Zarlink Semiconductor (NYSE/TSX:ZL) today
announced that it has joined the SHIFT Project (Smart
High-Integration Flex Technologies). Co-funded by the European
Commission, the project is developing flexible, highly
integrated packages for emerging electronicconsumer systems,
including medical devices, portable communication tools, smart
cards and aerospace utomotiveapplications.
The SHIFT Project consortium consists of R&D
institutes, industrial flex manufacturers, end-users and a
technology support agency. Zarlink’s participation in the
SHIFT Project is based in its Caldicot, UK site. The company’s
work will be initially focused on developing flexible packaging
technology for the personal medical device market. The first
SHIFT enabled product demonstrator from Zarlink will be
available in the summer off 2007 year.
With the increase in electronics systems
that are located near, on or even implanted in patients, product
manufacturers are seeking lightweight, flexible and compact
designs to increase product functionality, user comfort and
convenience. The embedding of components in fFlexible materials
such as polyimides will be are already being used todayas the
basis of these products. To boost the combination of high
functionality and compactness as well as user comfort, there is
a need for substantial development in the use of embedded
components in flex substrates.
“Medical electronic systems that move
along with the user increasingly require more functionality, and
must be extremely small, lightweight and available at a
reasonable price,” said David Heatherall, external project
leader at Zarlink’s Caldicot facility. “This trend is just
starting and it’s clear that we need to advance ‘smart’
packaging technology, which means developing a flexible
multilayer structure supporting multiple functions.”
Zarlink’s Caldicot facility is a leader
in advanced micropackaging solutions . for medical, high
reliability and security markets. It offers s unique SIP (system-in-package)solutions
that give approach delivers customers with the flexibility to
incorporate a higher profile components count and greater
functionality in a smaller space (die stacking, filters,
etc) than what is typically found in conventional electronic
assembliesmoulded SIP components.
For
more information about ZARLINK, please contact us:
info@techconsultzwinz.de
or
use our contact-formular
For
more information about SHIFT, please visit http://www.shift-project.org/.
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